Detail

Product features:

  1. 2 * 2 dual channel parallel process platform, with wide process applicability and high production efficiency

  2. Real time endpoint detection and intelligent process control system, advanced level cleaning architecture

  3. It can be widely used in manufacturing processes such as integrated circuits, advanced packaging, and large silicon wafers. Currently, it has been applied to multiple international mainstream production lines of 28nm and above


12 inch CMP equipment - Skylens

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Provide high-quality and comprehensive technical services to global customers.