Shuoke Jingwei 12 inch CMP equipment started validation in 2020
Overcoming key equipment and core technologies in the field of integrated circuit manufacturing
On November 22nd, reporters saw in the purification plant on the first floor of Beijing Shuoke Jingwei Electronic Equipment Co., Ltd. (hereinafter referred to as "Shuoke Jingwei") that staff were assembling a CMP (chemical mechanical planarization) equipment as a whole. Li Ting, General Manager of Shuoke Precision Micro, introduced that the CMP equipment developed by the company meets all the complex planarization process requirements in IC manufacturing, covering 8inch (200mm) and 12 inch (300mm) production lines. The HJP200 CMP equipment produced in bulk by the company has passed SEMI S2 and SEMI F47 certification, and has been verified by SMIC and Huahong Hongli's large-scale production line industrialization, entering the qualified supplier list and forming batch procurement. The 12 inch (300mm) CMP equipment will also enter the process validation stage in 2020.
CMP equipment, also known as chemical mechanical polishing equipment, is one of the key equipment in the field of integrated circuit manufacturing. Its principle is to use the comprehensive balance effect of chemical etching of polishing solution and mechanical friction of polishing pad to finely remove the surface material of the wafer. In integrated circuit manufacturing, CMP is first used for planarization, device isolation, and device construction in the pre manufacturing process of chips, and secondly, metal interconnects in the post manufacturing process of chips also need to be used. Meanwhile, CMP is also a key process technique in the TSV process of integrated circuit 3D packaging. It is precisely because of its relatively diverse and critical applications that CMP has become a standard process and core equipment in integrated circuit manufacturing.
Our equipment's various indicators meet the requirements of production line and meet the needs of integrated circuit production at 0.09-0.35um process nodes, breaking the previous situation where CMP equipment could only rely on imports and providing a guarantee for the independent controllability of CMP equipment in the integrated circuit industry. ”
Li Ting said that with the improvement of performance indicators of large-scale integrated circuit products, integrated circuit production enterprises need to continuously develop more advanced processes, among which advanced CMP technology is a key link. Shuoke Precision Micro CMP equipment is equipped with a high-precision grinding pressure control system, adding an online complex curve trimming mode for polishing pads, updating the control mode of chemical liquids, improving control accuracy, and making structural improvements to frequently maintained components, shortening single maintenance time and enhancing product performance.
It is reported that Shuoke Jingwei has established the first integrated 8-inch and 12 inch CMP overall solution development platform in China, supporting CMP related process material verification, process research and development, and equipment optimization, building a "product+process+material+service" system solution, and establishing a high-end CMP technology ecosystem system. In just two years since its launch, the 8-inch (200mm) CMP equipment has gradually gained recognition from the industry and market, completing import substitution.
Shuoke Jingwei, registered and established in the Economic Development Zone two months ago, is a mixed ownership company established by China Electronics Technology Group Corporation to achieve the transformation of scientific and technological achievements. It is also the first newly established company of China Electronics Technology Group Corporation to have a professional manager as its general manager. The company's mechanism, assessment system, management mode, etc. are more suitable for modern enterprise systems. In terms of business, Shuoke Jingwei insists on focusing on CMP, the core business of high-end integrated circuit equipment, to promote the research and industrialization process of key integrated circuit equipment. It plans to complete the laboratory process validation and data collection of 12 inch (300mm) CMP equipment in the second quarter of 2020, and then push the equipment to the production line for validation. After product validation is passed, mass production will begin.
For the next step of development, Li Ting said that Shuoke Jingwei will rely on the cluster effect of Yizhuang in the integrated circuit manufacturing industry to establish a domestic CMP complete process platform that integrates CMP equipment, consumables, ancillary equipment, and process demos, providing one-stop CMP technology solutions and realizing the localization of CMP complete technology. In addition, we are exploring and exploring in the field of integrated circuit planarization technology, delving into cutting-edge Finfet technology and planarization processes for special materials such as Ru/Co, continuously driving the development of next-generation planarization technology.